Important Dates

Submission Deadline

March 4, 2021


Registration Deadline

May 7, 2021


Conference Dates

May 14-16, 2021


Download

Paper Template (Download)

Co-Organized by

Welcome A.Prof. Wenbo Liu, Sichuan University, China to be the TPC!


A.Prof. Wenbo Liu, Sichuan University, China

His current research focus is advanced metal functional materials mainly including two aspects as follows: (1) nanostructured metal materials from fabrication to scientific understanding and to potential applications and (2) Mn-Cu based damping alloys from material design to technology development and to engineering applications. He has published over 80 journal papers in peer-reviewed good journals, such as Journal of Materials Chemistry A, Chemical Engineering Journal, Journal of Power Sources, Nanoscale, Corrosion Science, Electrochimica Acta, Materials & Design, Microporous and Mesoporous Materials, Journal of The Electrochemical Society, Journal of Alloys and Compounds, and so on. His papers are cited with a total ISI citation of over 800 by Jan 2021 and an H-index of 18. He is a holder of 15 Chinese patents while having 6 patent applications pending. Dr. Liu received several prizes and awards including the Hong Kong Scholars Award for his achievements in the field of Materials Science and Engineering in 2014. He is a life member of AASCIT, and is an editorial board member in IJEES.